Board Thickness:0.6mm
aperture: 0.4mm
Cu thickness: 1/1 oz
Au thickness :0.2um
impedance: /
Apply: communication equipment
conductor spacing: 5mil
Base Material : Aluminum-substrate
Surface Treatment : Plating gold
Remark: Thick AU (AU>0.2UM)
Our Capability:
Layer:1-20 layers
Material:FR4,CEM1,CEM3,FR2,Aluminium base
Copper Thickness:1/3OZ-4OZ
Board thickness:0.15-3.2mm
Min line width/spacing:0.1/0.1mm
Min drilling hole size:0.20mm
Advanced Technologies: Blind/Buried Via, HDI Micro via
Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP
Certificates:ISO9001,UL,ROHS
Price: Quite competitive especially for orders in huge quantities
Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.
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